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ERS electronic Introduces "High Power Dissipation" Thermal Chuck System, Which Can Dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND Wafer Test - 3D InCites
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ERS electronic announces the AC3 Fusion thermal chuck system, a versatile and more sustainable solution for temperature test in wafer probing - PR Newswire APAC
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ERS electronic GmbH | Germering
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ERS electronic unveils its third-generation flagship thermal debond machine | TechPowerUp
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ERS electronic Welcomes New Investor, European private equity firm Gimv, on Board to Accelerate Scaling Efforts - PR Newswire APAC
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